Influence of Microscale Tin Particles on Mechanical Properties of Silver Sintering Joints with Reduced Processing Parameters
| Categories |
Konferenz (reviewed) |
| Year | 2023 |
| Authors | S. Hadeler, Y. Long, R. Ottermann, F. Dencker, J. Twiefel, M. C. Wurz |
| Published in | 2023 IEEE 73nd Electronic Components and Technology Conference (ECTC) |
| DOI | 10.1109/ECTC51909.2023.00118 |
