Institute of Micro Production Technology Research Publications
Concept for Using MID Technology for Advanced Packaging

Concept for Using MID Technology for Advanced Packaging

Categories Konferenz (reviewed)
Year 2018
Authors M. Wurz, S. Bengsch, B. Roesener, S. Beringer
Published in IEEE 68th Electronic Components and Technology Conference (ECTC)
DOI 10.1109/ECTC.2018.00143