Concept for Using MID Technology for Advanced Packaging
| Categories |
Konferenz (reviewed) |
| Year | 2018 |
| Authors | M. Wurz, S. Bengsch, B. Roesener, S. Beringer |
| Published in | IEEE 68th Electronic Components and Technology Conference (ECTC) |
| DOI | 10.1109/ECTC.2018.00143 |
