Approaches for a Solely Electroless Metallization of Through-Glass Vias
| Categories |
Conferences (reviewed) |
| Year | 2022 |
| Authors | A. M. Zawacka, M. S. Prediger, A. Kassner, F. Dencker, M. Wurz |
| Published in | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) |
| DOI | 10.1109/ECTC51906.2022.00145 |
