Electroplating through Fluidic Channels as Production Technology for 3D Interconnect Devices and Sensing Structures
| Categories |
Konferenz |
| Year | 2016 |
| Authors | Rechel M, Bengsch S, Wurz MC |
| Published in | ECS Transactions. 2016 volume 75, issue 7, 25-32 |
| DOI | 10.1149/07507.0025ecst |
| More info | |
