Detection of joining mechanisms at different locations of the wire/substrate interface during ultrasonic wire bonding via a PZT-based sensor array
| Categories |
Zeitschrift (reviewed) |
| Year | 2023 |
| Authors | Long, Y.; Arndt, M.; Sun, C.; Dencker, F.; Wurz, M.; Twiefel, J. |
| Published in | Journal of Materials Processing Technology, 312, 117826, 2023 |
| DOI | doi.org/10.1016/j.jmatprotec.2022.117826 |
