AcademiaCourses
"Aufbau- und Verbindungstechnik"

"Aufbau- und Verbindungstechnik"

Course Category
Lecture and Tutorial
Level
Hauptstudium / Master
SemesterSummer Semester
Creditpoints
5 CP

COURSE GOAL

The aim of the course is to impart knowledge about processes and plants which serve to house components and to connect components. Essential is the description of the processes which are part of the work areas packaging, surface mounting of components and chip on board.

COURSE CONTENT

Packaging and interconnection technology is concerned with processes that serve to house components and to connect components. Processes for packaging, surface mounting of components and chip-on-board are presented.

  • Fundamentals of SMD technology
  • Methods of the COB technique
  • Die-Bonds
  • Wire bonding - Thermosonic, thermocompression and ultrasonic bonding
  • Casting and moulding
  • Advanced packaging
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