-
A. Buchta, A. Kassner, J. Voß, J.Petring, L. Diekmann, F. Dencker, M. C. Wurz
(2023):
Novel Glass-Silicon Emitter Chip for Field Emission Applications,
2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC)
DOI:
10.1109/IVNC57695.2023.10188880
-
B. Denkena, H. Klemme, D. Kowalke, M. Korbacher, R. Ottermann, F. Dencker, M. C. Wurz
(2023):
Force sensing linear rolling guides based on modified metal strain gauges,
Euspen 23rd International Conference & Exhibition
DOI:
10.1109/ECTC51909.2023.00118
-
O. Altun, P. Oladazimi, M. Wawer, S. Raumel, M. C. Wurz, K. Barienti, F. Nürnberger, R. Lachmayer, I. Mozgova, O. Koepler, S. Auer
(2023):
Enhanced findability and reusability of Engineering Data by Contextual Metadata,
24th International Conference on Engineering Design, ICED23 Bordeaux, France, July 2023
-
O. Altun, P. Oladazimi, M.L. Wawer, S. Raumel, M. Wurz, K. Barienti, F. Nürnberger, R. Lachmayer, I. Mozogova, O. Koepler, S. Auer
(2023):
Enhanced findability and reusability of engineering data by contextual metadata,
Proceedings of the Design Society , Volume 3: ICED23 , July 2023 , pp. 1635 - 1644
DOI:
https://doi.org/10.1017/pds.2023.164
-
S. Hadeler, Y. Long, R. Ottermann, F. Dencker, J. Twiefel, M. C. Wurz
(2023):
Influence of Microscale Tin Particles on Mechanical Properties of Silver Sintering Joints with Reduced Processing Parameters,
2023 IEEE 73nd Electronic Components and Technology Conference (ECTC)
DOI:
10.1109/ECTC51909.2023.00118
-
S. Kamrani, F. Dencker, R. Ottermann, M. C. Wurz
(2023):
Simulation, Manufacturing and Evaluation of a Transformer Eddy-Current Sensor for Deep-Drawing Processes,
SMSI Sensor and Measurement Science International, 08.-11.05.2023 Nürnberg
DOI:
10.5162/SMSI2023/P02
-
S. Raumel, L. Albracht, U. Holländer, S. Hübner, B.-A. Behrens, A. Langohr, E. Faramand, M. Wurz
(2023):
Oxygen-free resistance heating with nitrogen and silane as an energy-efficient heating process for hot stamping,
42nd International Deep Drawing Research Group Conference
DOI:
10.1088/1757-899X/1284/1/012007
-
A. M. Zawacka, M. S. Prediger, A. Kassner, F. Dencker, M. Wurz
(2022):
Approaches for a Solely Electroless Metallization of Through-Glass Vias,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
DOI:
10.1109/ECTC51906.2022.00145
-
L. Steinhoff, F. Dencker, M. C. Wurz
(2022):
Production and characterisation of batch manufactured flexible micro-grinding tools for finishing metallic surfaces,
euspen's 22nd International Conference & Exhibition 2022
-
M. Arndt, T. Fünfkirchler, S. Hübner, F. Dencker, M. C. Wurz, B.-A. Behrens
(2022):
Monitoring of the flange draw-in during deep drawing processes using a thin-film inductive sensor,
12. Kongress der deutschen WPG - Wissenschaftliche Gesellschaft für Produktionstechnik, Stuttgart, Germany, October 2022
DOI:
10.1007/978-3-031-18318-8_12
-
R. Ottermann, S. Zhang, B. Denkena, H. Klemme, D. Kowalke, M. Korbacher, F. Dencker, M. Wurz
(2022):
In Situ Resistance Trimming of Directly Deposited Thin-Film Strain Gauges,
IEEE Sensors 2022
DOI:
10.1109/SENSORS52175.2022.9967357
-
S. Raumel, F. Dencker, M. C. Wurz
(2022):
Influence of oxide layers on plastic deformability of copper,
7th World Tribology Congress 2022
-
S. Raumel, M. Wurz, F. Dencker
(2022):
Batch Fabrication of Silicon Indenter Tips for adhesion investigations using Deep Reactive Ion Etching (DRIE),
Nanobrücken 2022 - Nanomechanical Testing Conference
-
A. Glukhovskoy, M. Prediger, J. Schäfer, N. Ambrosius, A. Vogt, R. Santos, R. Ostholt, M. C. Wurz
(2021):
Proof of Concept: Glass-Membrane Based Differential Pressure Sensor,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
DOI:
DOI 10.1109/ECTC32696.2021.00248
-
R. Ottermann, D. Klaas, F. Dencker, D. Hoheisel, S. Jung, A. Wienke, J. Düsing, J. Koch, M.C. Wurz
(2021):
Directly Deposited Thin-Film Strain Gauges on Curved Metallic Surfaces,
IEEE Sensors 2021
-
S. de Wall, E.C. Fischer, F. Dencker, M.C. Wurz, S. Bengsch
(2021):
Anisotropic Magneto-Resistive Effect based Sensor using Daisy Chain on Polyether Ether Ketone Substrate,
IEEE Sensors 2021
-
S. Hadeler, R. Ottermann, Y. Long, F. Dencker, M.C. Wurz, J. Twiefel
(2021):
Investigations on Silver Sintering using an Ultrasonic Transient Liquid Phase Sintering Process,
IEEE Electronics Packaging Technology Conference (EPTC)
-
Arndt M, Dencker F, Wurz MC
(2020):
Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding,
IEEE 70th Electronic Comp. and Techn. Conf. (ECTC)
DOI:
10.1109/ECTC32862.2020.00053
-
Fischer EC, Bengsch S, de Wall S, Wurz MC
(2020):
Giant Magneto-Resistive Effect based Sensor on Laser Direct Structured MID Substrates,
IEEE 70th Electronic Comp. and Techn. Conf. (ECTC)
DOI:
10.1109/ECTC32862.2020.00077
-
R. Ottermann, D. Klaas, F. Dencker, D. Hoheisel, P. Rottengatter, T. Kruspe, M.C. Wurz
(2020):
Direct Deposition of Thin-Film Strain Gauges with a New Coating System for Elevated Temperatures,
IEEE Sensors 2020
DOI:
10.1109/SENSORS47125.2020.9278661
-
Raumel S, Barienti K, Dencker F, Wurz MC
(2020):
Einfluss von Silan-dotierten Umgebungsatmosphären auf die tribologischen Eigenschaften von Titan,
61. Tribologie-Fachtagung 2020
-
S. Bengsch, E. C. Fischer, S. de Wall, T. Schelm, M. Arndt, M. C. Wurz
(2020):
Optical Platform for Highly Precise Optical Components,
IEEE 70th Electronic Comp. and Techn. Conf. (ECTC)
DOI:
10.1109/ECTC32862.2020.00341
-
S. Bengsch, M. Wurz
(2020):
Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates,
2020 IEEE Photonics Conference (IPC)
-
S. Bengsch, U. Giese, E. C. Fischer, M. C. Wurz
(2020):
Thin Film Transferring via PVA Substrate and Contacting of Sensor inside Elastomer Matrix,
IEEE Sensors 2020
DOI:
10.1109/SENSORS47125.2020.9278876
-
S. de Wall, A. Kassner, F. Dencker, C. Künzler, H. Heine, W. Herr, M. Christ, M. Krutzik, E. M. Rasel, M. C. Wurz
(2020):
Mikrotechnologische Fertigung von integrierten optischen Gittern für den Einsatz in Atominterferometern,
Mikro-Nano-Integration - 8. GMM-Workshop, 2020
-
S. Hadeler, S. Bengsch, M. Prediger, M. C. Wurz
(2020):
Transfer Printing of Conductive Thin Films on PDMS with Soluble Substrates for Flexible Biosensors,
7th International Electronic Conference on Sensors and Applications (ECSA)
DOI:
10.3390/ecsa-7-08181
-
Arndt M, Dencker F, Wurz MC
(2019):
Novel Eddy-Current Sensor For Industrial Deep-Drawing Applications,
IEEE Sensors 2019
DOI:
10.1109/SENSORS43011.2019.8956948
-
Bengsch S, Aue M, Cromwell K, Wurz MC
(2019):
Structuring of Laser Activated Polymers for Sensor Applications,
IEEE 69th Electronic Components and Technology Conference (ECTC)
DOI:
10.1109/ECTC.2019.00290
-
Schmelt AS, Fischer EC, Hofmann V, Twiefel J, Wurz MC
(2019):
Vibro-tactile displays for stimulating surface impressions,
Proceedings of the 23rd International Congress on Acoustics
-
Asadi E, Hockauf R, Denkena B, Grove T, Wurz MC
(2018):
Flexible mono- and multilayer micro grinding tools for ultra-high precision processing and micro machining,
18th International Conference & Exhibition proceedings, pp. 151-152, Venedig, Italien, June 2018
-
Bengsch S, Aue M, de Wall S, Wurz MC
(2018):
Structuring Methods of Polymers for Low Cost Sensor Manufacturing,
IEEE 68th Electronic Components and Technology Conference (ECTC)
| Datei |
Weitere Informationen
DOI:
10.1109/ECTC.2018.00213
ISBN:
978-1-5386-4999-2
-
Christ M, Kassner A, Smol R, Bawamia A, Peters A, Wurz MC, Rasel EM, Wicht A and Krutzik M
(2018):
Integrated Atomic Quantum Technologies in Demanding Environments: Development and Qualification of Miniaturized Optical Setups and Integration Technologies for UHV and Space Operation,
International Conference on Space Optics 2018, ICSO 2018
-
G. L. Angrisani, P. Taptimthong, S. E. Thürer, C. Klose, H. J. Maier, M. Wurz, K. Möhwald
(2018):
Magnetic Properties of Thermal Sprayed Tungsten Carbide-Cobalt Coating,
Advanced Engineering Materials 20 (9)
DOI:
10.1002/adem.201800102
-
Hockauf R, Asadi E, Denkena B, Grove T, Wurz MC
(2018):
Grinding of riblets with “beaver tooth” multi-layer tools,
4th CIRP Conference on Surface Integrity, Tianjin, China, Juli 2018
-
Isaak A, Long Y, Asadi E, Wurz M, Twiefel J, Wallaschek J
(2018):
Fabrication and characterization of high-speed PZT sensors for the investigation of ultrasonic wire bonding process,
euspen’s 18th International Conference & Exhibition
-
Long Y, Dencker F, Isaak A, Schneider F, Hermsdor J, Wurz MC, Twiefel J
(2018):
Visualization of Oxide Removal during Ultrasonic Wire Bonding Process,
IEEE Electronics Packaging Technology Conference (EPTC), Singapore, p. 1-4
-
M. Wurz, S. Bengsch, B. Roesener, S. Beringer
(2018):
Concept for Using MID Technology for Advanced Packaging,
IEEE 68th Electronic Components and Technology Conference (ECTC)
DOI:
10.1109/ECTC.2018.00143
-
Schlangen S, Bremer K, Isaak A, Wurz MC, Bonilla G, Neumann J, Roth B, Overmeyer L
(2018):
Mode-selective polished fiber couplers based on fiber gratings,
The Optical Fiber Communication Conference and Exhibition (OFC)
Weitere Informationen
DOI:
10.1364/OFC.2018.Th1K.6
ISBN:
978-1-943580-38-5
-
Schlangen S, Bremer K, Zheng Y, Isaak A, Wurz MC
(2018):
Manufacturing and characterization of asymmetric evanescent field polished fiber couplers for fiber grating assisted mode selective coupling,
SPIE Photonics Europe
Weitere Informationen
DOI:
10.1117/12.2306772
-
Schmelt AS, Fischer EC, Wurz MC, Twiefel J
(2018):
Solid State Joint Actuator for a Vibro Tactile Line Display,
ACTUATOR 2018, 16th International Conference on New Actuators, Bremen
Weitere Informationen
ISBN:
978-3-8007-4675-0
-
A. S. Schmelt, V. Hofmann, J. Twiefel, E. C. Fischer, M. Wurz
(2017):
Modeling and Characterization of a Bimodal Tactile Display,
International Workshop on Piezoelectric Materials and Applications in Actuators (IWPMA)
-
B. Denkena, M. C. Wurz, T. Grove, A. Bouabid, E. Asadi
(2017):
Mass production for micro end mills,
17th Euspen Int. Conf., S. 245-246, Hannover, 2017
-
Dencker F, Kolodziejczyk F, Wurz MC
(2017):
Electrical feed through for tool integrated high temperature applications,
International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
ISBN:
978-395735057-2
-
Dencker F, Schlenkrich A, Wurz MC
(2017):
Press hardening tool integrated thin film temperature sensor,
Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017
ISBN:
978-099577510-7
-
E. Pyatishev, Y. Enns, I. Komarevtsev, A. Glukhovskoy, M. Wurz
(2017):
A micromechanical gyroscope with bistable suspension of microdrive,
Proceedings of 24th Saint Petersburg International Conference on Integrated Navigation Systems (ICINS)
DOI:
10.23919/ICINS.2017.7995646
-
Long Y, Dencker F, Isaak A, Li C, Schneider F, Hermsdor J, Wurz MC, Twiefel J, Wallaschek J
(2017):
Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process,
IEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, p. 203-206
-
Long Y, Dencker F, Schneider F, Emde B, Li C, Hermsdorf J, Wurz MC, Twiefel J
(2017):
Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process,
Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016
DOI:
10.1109/EPTC.2016.7861512
ISBN:
978-150904368-2
-
Pyatishev E, Enns Y, Komarevtsev I, Glukhovskoy A, Wurz MC
(2017):
A micromechanical gyroscope with bistable suspension of microdrive,
Proceedings of 24th Saint Petersburg International Conference on Integrated Navigation Systems (ICINS)
DOI:
10.23919/ICINS.2017.7995646
-
Schmelt AS, Hofmann V, Twiefel J, Fischer EC, Wurz MC
(2017):
Modeling and Characterization of a Bimodal Tactile Display,
International Workshop on Piezoelectric Materials and Applications in Actuators (IWPMA)
-
Bengsch S, Rechel M, Asadi E, Wurz MC
(2016):
Structuring Methods of Plastic Substrates for Electroplating Applications,
229th ECS Meeting, San Diego, 2016
-
Beringer S, Dinulovic D, Haug M, Rissing L, Wurz MC
(2016):
Development and Optimization of Thin-Film Technology Based Micro Inductors and Transformers,
ECS Trans. 2016 volume 75,issue 2, 51-58
Weitere Informationen
DOI:
10.1149/07502.0051ecst
-
Dencker F, Wurz MC, Dubrovskiy S, Koroleva E
(2016):
An application report: Protective thin film layers for high temperature sensor technology,
Proceedings of the 2016 IEEE North West Russia Section Young Researchers in Electrical and Electronic Engineering Conference, EIConRusNW 2016
DOI:
10.1109/EIConRusNW.2016.7448110
ISBN:
978-150900445-4
-
Jogschies L, Rittinger J,Klaas D, Wurz MC
(2016):
Stress Reduction in sputtered thin NiFe 81/19 layers for Magnetic Field Sensor,
3rd International Conference on System-integrated Intelligence: New Challenges for Product and Production Engineering, SysInt 2016, Procedia Technology 26, pp. 162-168
Weitere Informationen
DOI:
10.1016/j.protcy.2016.08.022
-
Klaas D, Rein M, Wurz MC, Rissing L
(2016):
Development of a Humidity Sensor Element based on sputter-deposited Thin ZnO-Layers,
3rd International Conference on System-integrated Intelligence: New Challenges for Product and Production Engineering, SysInt 2016, Procedia Technology 26, pp. 27-34
Weitere Informationen
DOI:
10.1016/j.protcy.2016.08.005
-
Kusch A, Rissing L, Wurz MC
(2016):
Concept Development and Evaluation of a hermetically sealed Ceramic Package,
International Conference and Exhibition on Integration Issues of Miniaturized Systems (SSI2016), München, pp. 413-416
-
M. Stompe, E. Asadi, L. Rissing, M. C. Wurz
(2016):
Investigation for thinning-by-dicing of sintered and unsintered ceramics,
16th International Conference & Exhibition proceedings, pp. 325-326, Notthingham, June 2016
-
Taptimthong P, Düsing JF, Rissing L, Wurz MC
(2016):
Flexible Magnetic Reading/Writing System: Heat-Assisted Magnetic Recording,
3rd International Conference on System-integrated Intelligence: New Challenges for Product and Production Engineering, SysInt 2016, Procedia Technology 26, pp. 72-78
Weitere Informationen
DOI:
10.1016/j.protcy.2016.08.011
-
Taptimthong P, Rissing L, Wurz MC
(2016):
Flexible Magnetic Reading/Writing System: Characterization of a Read/Write Head,
18. GMS/ITG-Fachtagung Sensoren und Messsysteme (SUM2016), Nürnberg, pp. 769-775
Weitere Informationen
DOI:
10.5162/sensoren2016/P8.1
-
B. M. Mundotiya, M. C. Wurz, L. Rissing
(2015):
A Comparative Study of Saturation Induction with Current Density of Electrodeposited Fe-Ni-W Alloys,
ECS Trans., Vol. 64, Issue No. 31, Magnetic Materials, Processes, and Devices 13, pp. 75-83
DOI:
10.1149/06431.0075ecst
-
D. Dinulovic, A. Gerfer, M. Haug, M. Kaiser, M. C. Wurz, L. Rissing
(2015):
Improved Microtransformer Design Utilizing Fe-Co Magnetic Core,
20th Int. Conf. on Magnetism (ICM 2015), Elsevier, Physics Procedia, Vol. 75, pp. 1252-1258
-
D. Klaas, A. Wienecke, M.C. Wurz, L. Rissing, P. Freytag, H.J. Maier
(2015):
Smart System Integration: Moulding of Magnetic Field Sensors into AlSi9Cu3(Fe)-Alloys,
SMTA Pan Pacific Microelectronics Symposium, Kauai, HI, USA
-
D. Klaas, J. Rittinger, P. Taptimthong, J. F. Düsing, M. C. Wurz, L. Rissing
(2015):
Verwendung von Schattenmasken zur Direktstrukturierung individuell adaptierbarer Sensorik auf technischen Oberflächen,
MST Kongress 2015, Karlsruhe, 26. - 28. Oktober 2015, pp. 338-341
ISBN:
978-3-8007-4100-7
-
J. Rittinger, D. Klaas, M. C. Wurz, L. Rissing
(2015):
Hybrider Fertigungsprozess zur Integration von Drucksensoren auf die Oberfläche von Tellerfedern,
MST Kongress 2015, Karlsruhe, 26. - 28. Oktober 2015, pp. 563-566
ISBN:
978-3-8007-4100-7
-
J. Rittinger, P. Taptimthong, L. Jogschies, M. C. Wurz, L. Rissing
(2015):
Impact of different polyimide-based substrates on the soft magnetic properties of NiFe thin films,
SPIE Microtechnologies (pp. 95171R-95171R). International Society for Optics and Photonics
-
Meriem Akin, Joe Corea, Simon Scott, Ana Claudia Arias, Marc Wurz, Lutz Rissing
(2015):
Hybrid packaging of circuits and devices onto flexible screen printed electrical interconnects,
SMTA Pan Pacific Microelectronics Symposium, Kauai, HI, USA
DOI:
10.13140/RG.2.1.2064.9763/1
-
P. Taptimthong, J. Rittinger, M. C. Wurz, L. Rissing
(2015):
Flexibles magnetisches Lese-/Schreibsystem: Design eines Schreibkopfes,
MST Kongress 2015, Karlsruhe, 26. - 28. Oktober 2015, pp. 684-687
ISBN:
978-3-8007-4100-7
-
A. Wienecke, M. C. Wurz, L. Rissing
(2014):
Integrierte Sensorik für Hochtemperaturumgebungen,
GMM, VDI/VDE-IT (eds) Tagungsband: MikroSystemTechnikKongress 2013. Von Bauelementen zu Systemen, 14.-16. Oktober 2013 in Aachen, pp. 555–558
-
L. Rissing, A.Belski, T. Creutzburg, T. Griesbach, M. Kaiser, A. Wienecke, M. C. Wurz
(2014):
Magnetic MEMS,
Semicon Russia 2014, St. Petersburg, St. Petersburg State Polytechnical University Journal 5 (205), pp. 21-35
-
P. Taptimthong, J. Rittinger, M. C. Wurz, L. Rissing
(2014):
Flexible Magnetic Writing / Reading System: Polyimide Film as Flexible Substrate,
Procedia Technology, Vol. 15, 2014, pp. 230–237
DOI:
10.1016/j.protcy.2014.09.076
-
A. Belski, M. Wurz, J. Rittinger, L. Rissing
(2013):
Development, Micro Fabrication and Test of Flexible Magnetic Write Head for Gentelligent Applications,
Microelectronic Engineering Journal, (spec. issue), Proc. 38th Int. Conf. on Micro & Nanoengineering, Toulouse, France
-
A. Belski, P. Taptimthong, M. C. Wurz, L. Rissing
(2013):
High permeability flexible bulk material for magnetic micro head applications,
JEMS 2012, EPJ Web Conferences, Volume 40, Parma, Italy
DOI:
10.1051/epjconf/20134016003
-
D. Dinulovic, M. Kaiser, A. Gerfer, O. Opitz, M.C. Wurz, L. Rissing
(2013):
Thin-film Microtransformer for High Frequency Power Applications,
Joint European Magnetic Symposia 2013 (JEMS), Rhodos, Greece, p. 153
-
A. Belski, M.C. Wurz, S. Cvetkovic, L. Rissing
(2012):
Surface Preparation for Sensing the Kerr-effect on NiFe81/19 Layers,
Proc. 12th euspen Int. Conf. 2012, Stockholm, Sweden, pp. 279-282
-
A. Belski, P. Taptimthong, M. Wurz, L. Rissing
(2012):
Integration of the Read-after-write Method for GentelligentTM Applications,
1st Joint International Symposium on System-Integrated Intelligence (Sysint 2012), Hanover, Germany, pp. 49-51
-
J. Chen, M. Wurz, L. Rissing
(2012):
Designs and Characterizations of Soft Magnetic Flux Guides in a 3D magnetic field sensor,
IEEE Transaction on Magnetics, Vol. 48, No. 4, pp. 1481-1484
-
L. Rissing, M. Wurz, S. Cvetkovic, F.-W. Bach
(2012):
Electroplating of Cu/Sn Layers for Hermetic Encapsulation for Vacuum Applications,
Trans. 222nd ECS Meeting, Honolulu, Hawaii, Vol. 50, No. 10, pp. 207-216
-
M. Kaiser, M.C. Wurz, S. Cvetkovic, L. Rissing
(2012):
Embossing of Soft-magnetic Structures and Influence on Magnetic Properties,
Trans. 222nd ECS Meeting, Honolulu, Hawaii, Vol. 50, No. 10, pp. 189-197
-
M. Wurz, A. Shaganov, L. Rissing, A. Filimonov, S. Vakhrushev
(2012):
Investigation of the Crystallization of FiFe81/19 Depending on the Annealing Temperature,
Trans. 222nd ECS Meeting, Honolulu, Hawaii, Vol. 50, No. 10, pp. 147-156
-
A. Belski, M. Wurz, L.Rissing
(2011):
Redesign and Fabrication of a Magnetic Head for GentelligentTM
Products,
11th Euspen International Conf. 2011, Como, Italy, 2011
-
H.H. Gatzen, T. Griesbach, M. C. Wurz, L. Rissing
(2011):
Considerations on Ultra-thin Substrateless
Micro and Nano Systems,
Proc. ASME2011 & Exp. IMECE2011, Denver, CO, USA, 2011
-
T. Griesbach, M. C. Wurz, L. Rissing
(2011):
Application of Sacrificial Layers fort he Modular
Micro Sensor Fabrication on a Flexible Polymer Substrate,
Proc. CD, Sensor + Test
Conf. 2011 – Sensor, Opto, IRS2, Nuremberg, Germany
ISBN:
978-3-9810993-9-3
-
T. Griesbach, M. C. Wurz, L. Rissing
(2011):
Modular Eddy Current Micro Sensor,
IEEE International
Magnetics Conf. (Intermag 2011), Taipei, Taiwan, 2011
-
T. Griesbach, M. C. Wurz, L. Rissing
(2011):
Design and Fabrication of a Modular Eddy Current
Micro Sensor,
Proc. 29th Progress In Electromagnetics Research Symposium (PIERS
2011), Marrakesh, Morocco, pp. 752-755, 2011
-
B. Spasova, M. C. Wurz, C. Ruffert, J. Norpoth, Ch. Jooss, H.H. Gatzen
(2010):
Using Magnetooptical
Measurements for the Evaluation of a Hybrid Magnetic Shape Memory (MSM) Based Microactuator,
Transactions on Magnetics, Vol. 46, Issue 6, pp. 2256-2259, 2010
-
M. C. Wurz, C. Ruffert, H.H. Gatzen
(2010):
Methodology for Concurrent Nano-Engineering. Proc.
CD, IAMOT 2010, Cairo, Egypt, 2010,
Proc.
CD, IAMOT 2010, Cairo, Egypt, 2010
-
O. Traisigkhachol, H. Schmid, M. C. Wurz, H.H. Gatzen
(2010):
Applying SU-8TM to the Fabrication
of Micro Electro Discharge Machining Electrodes,
Microsystem Technologies, Springer Verlag,
Berlin, Heidelberg, New York, Vol. 16, No. 8-9, pp. 1445-1450, 2010
-
H.H. Gatzen, C. Ruffert, M.C. Wurz, E. Flick
(2009):
Magnetische Mikrosysteme für Wandleranwendungen. Magnetic Micro Electro-mechanical Systems (MEMS) for Transducer Applications,
Proc. MST-Kongress 2009, Berlin, Deutschland, S.425-428
-
M.C. Wurz, F. Pape, M. Wark, H.H. Gatzen
(2009):
Investigation of Fluidic Additives on the Nanohardness During Polishing,
Proc. WTC 09, Kyoto, Japan, K-331, pp. 698
-
W.Z. Li, W.W. Wang, E. Delyagina, A. Kaminski, N. Ma, G. Steinhoff, E. Flick, M.C. Wurz, H.H. Gatzen, X.S. Gao, M. Alexe, D. Hesse
(2009):
Magnetic Polymer Nanoparticles in Gene Delivery Applications,
Book of Abstracts, 1st Symposium of the SFB/TR 37, Aachen, Germany, pp. 3
-
B. Spasova, M.C. Wurz, H.H. Gatzen
(2008):
Fabrication and Characterization of Microactuators with Discrete MSM Bulk Material,
Proc. 11th Int. Conf. on new Actuators 2008, Bremen, Germany, pp. 713-716
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M. Wurz, D. Dinulovic, J. Chen, E. Flick, K. Bade, V. Saile, H.H. Gatzen
(2008):
Design of Experiment (DOE) for Optimizing a NiFe 45/55 Electroplating Process,
PRiME 2008 Meeting, Honolulu, HI, USA, The Electrochemical Society, MA 2008-2, Abs. 2583.pdf
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M. Wurz, T. Oeckermann, P. Wagner, C. Ruffert, J. Caro, H.H. Gatzen
(2008):
Investigations on Embedding Nanoparticles by Electroplating,
PRiME 2008 Meeting, Honolulu, HI, USA, The Electrochemical Society, MA 2008-2, Abs. 2595.pdf
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M.C. Wurz, D. Dinulovic, H.H. Gatzen
(2004):
Investigation of the permeability on electroplated and sputtered permalloy,
Proc. 8th Int. Symposium on Magnetic Materials, Processes and Devices, 206th Meet. of The Electrochemical Society 2004, Honolulu, Hawaii, USA, pp. 526-536