Publikationen

Zeitschriften/Aufsätze (reviewed)

  • L. Steinhoff, R. Ottermann, F. Dencker, M. C. Wurz (2023): Detailed characterisation of batch-manufactured flexible micro-grinding tools for electrochemical assisted grinding of copper surfacesThe International Journal of Advanced Manufacturing Technology
    DOI: https://doi.org/10.1007/s00170-023-11876-2
  • R. Ottermann; T. Steppeler; F. Dencker; M. Wurz (2022): Degeneration Effects of Thin-Film Sensors after Critical Load Conditions of Machine ComponentsMachines 2022, 10, 870
    DOI: https://doi.org/10.3390/machines10100870
  • S. Heikebrügge, R. Ottermann, B. Breidenstein, M. Wurz, F. Dencker (2022): Residual Stresses from Incremental Hole Drilling Using Directly Deposited Thin Film Strain GaugesExperimental Mechanics
    DOI: https://doi.org/10.1007/s11340-022-00822-0
  • Klaas D, Ottermann R, Dencker F, Wurz MC (2020): Development, Characterisation and High-Temperature Suitability of Thin-Film Strain Gauges Directly Deposited with a New Sputter Coating SystemMDPI Sensors
    DOI: 10.3390/s20113294

Konferenz (reviewed)

  • B. Denkena, H. Klemme, D. Kowalke, M. Korbacher, R. Ottermann, F. Dencker, M. C. Wurz (2023): Force sensing linear rolling guides based on modified metal strain gaugesEuspen 23rd International Conference & Exhibition
    DOI: 10.1109/ECTC51909.2023.00118
  • S. Hadeler, Y. Long, R. Ottermann, F. Dencker, J. Twiefel, M. C. Wurz (2023): Influence of Microscale Tin Particles on Mechanical Properties of Silver Sintering Joints with Reduced Processing Parameters2023 IEEE 73nd Electronic Components and Technology Conference (ECTC)
    DOI: 10.1109/ECTC51909.2023.00118
  • S. Kamrani, F. Dencker, R. Ottermann, M. C. Wurz (2023): Simulation, Manufacturing and Evaluation of a Transformer Eddy-Current Sensor for Deep-Drawing ProcessesSMSI Sensor and Measurement Science International, 08.-11.05.2023 Nürnberg
    DOI: 10.5162/SMSI2023/P02
  • R. Ottermann, S. Zhang, B. Denkena, H. Klemme, D. Kowalke, M. Korbacher, F. Dencker, M. Wurz (2022): In Situ Resistance Trimming of Directly Deposited Thin-Film Strain GaugesIEEE Sensors 2022
    DOI: 10.1109/SENSORS52175.2022.9967357
  • R. Ottermann, D. Klaas, F. Dencker, D. Hoheisel, S. Jung, A. Wienke, J. Düsing, J. Koch, M.C. Wurz (2021): Directly Deposited Thin-Film Strain Gauges on Curved Metallic SurfacesIEEE Sensors 2021
  • S. Hadeler, R. Ottermann, Y. Long, F. Dencker, M.C. Wurz, J. Twiefel (2021): Investigations on Silver Sintering using an Ultrasonic Transient Liquid Phase Sintering ProcessIEEE Electronics Packaging Technology Conference (EPTC)
  • R. Ottermann, D. Klaas, F. Dencker, D. Hoheisel, P. Rottengatter, T. Kruspe, M.C. Wurz (2020): Direct Deposition of Thin-Film Strain Gauges with a New Coating System for Elevated TemperaturesIEEE Sensors 2020
    DOI: 10.1109/SENSORS47125.2020.9278661

Konferenz

  • D. Konopka, F. Pape, R. Ottermann, T. Steppeler, F. Dencker, M. C. Wurz, G. Poll (2022): Characterization of an anti-wear coating for the application of highly loaded smart thin-film sensorsInternational Conference BALTTRIB, Kaunas, Lithuania, September 2022
    DOI: 10.15544/balttrib.2022.9
  • R. Ottermann, D. Klaas, F. Dencker, D. Hoheisel, P. Rottengatter, T. Kruspe, S. Jung, M.C. Wurz (2021): Direktabgeschiedene Dünnfilm-Dehnungsmessstreifen für erhöhte TemperaturenMikroSystemKongress 2021
  • R. Ottermann, D. Klaas, F. Dencker, M. C. Wurz (2021): Direktabgeschiedene Dünnfilmsensorik mithilfe einer neuartigen BeschichtungsanlageNDVaK - Neues Dresdner Vakuumkolloquium
  • Ottermann R, Knöpke R, Wurz MC (2019): Elektrische Kontaktierung bauteilinhärenter Dehnungsmesssensorik mithilfe des Transient Liquid Phase (TLP) BondingMikroSystemTechnik Kongress 2019
    ISBN: 978-3-8007-5090-0

Patentschriften

  • F. Dencker, M.C. Wurz, H.J. Maier, R. Ottermann, D. Klaas, A. Kassner (2021): Sensorbauteil, Halbzeug, Verfahren zur Anbringung und zur Herstellung eines SensorbauteilsDE102019122623A1 WO002021032878A1

Verschiedenes