Reduction of Thermomechanical Stress Using Electrically Conductive Adhesives
| Kategorien |
Zeitschriften/Aufsätze (reviewed) |
| Jahr | 2015 |
| Autoren | T. Geipel, L. C. Rendler, M. Stompe, U.h Eitner, L. Rissing |
| Veröffentlicht in | Energy Procedia, Volume 77, August 2015, Pages 346-355, ISSN 1876-6102 |
| DOI | 10.1016/j.egypro.2015.07.049 |
