Concept for Using MID Technology for Advanced Packaging
Kategorien |
Konferenz (reviewed) |
Jahr | 2018 |
Autoren | M. Wurz, S. Bengsch, B. Roesener, S. Beringer |
Veröffentlicht in | IEEE 68th Electronic Components and Technology Conference (ECTC) |
DOI | 10.1109/ECTC.2018.00143 |