ForschungPublikationen
The Application of Chemical-Mechanical Polishing for Planarizing a SU-8/Permalloy Combination Used in MEMS Devices

The Application of Chemical-Mechanical Polishing for Planarizing a SU-8/Permalloy Combination Used in MEMS Devices

Kategorien Zeitschriften/Aufsätze
Jahr 2003
Autoren C. Kourouklis, T. Kohlmeier, H.H. Gatzen
Veröffentlicht in Sensors & Actuators A: Physical, Vol. 106, No. 1-3, pp. 268-271