Investigations on the Influence of the Substrate’s Thickness on the Cut Quality During Dicing of thin Silicon Wafers
| Kategorien |
Konferenz (reviewed) |
| Jahr | 2005 |
| Autoren | H.H. Gatzen, G. Günzel |
| Veröffentlicht in | Proc. euspen 5th Int. Conf. and 7th Ann. Gen. Meet. 2005, Montpellier, France, Vol. 2, pp. 589-590 |
