ForschungPublikationen
Investigations on the Influence of the Substrate’s Thickness on the Cut Quality During Dicing of thin Silicon Wafers

Investigations on the Influence of the Substrate’s Thickness on the Cut Quality During Dicing of thin Silicon Wafers

Kategorien Konferenz (reviewed)
Jahr 2005
Autoren H.H. Gatzen, G. Günzel
Veröffentlicht in Proc. euspen 5th Int. Conf. and 7th Ann. Gen. Meet. 2005, Montpellier, France, Vol. 2, pp. 589-590