Ultra-precision Dicing and Wire Sawing of Silicon Carbide (SiC)
| Kategorien |
Zeitschriften/Aufsätze |
| Jahr | 2011 |
| Autoren | S. Cvetkovic, C. Morsbach, L. Rissing |
| Veröffentlicht in | “Microelectronic Engineering” Journal (spec. issue), Proc. 36th International Conf. on Micro&Nanoengineering (MNE10), Genoa, Italy, Vol.88, Nr. 9, 2011, pp. 2500-2504 |
