ForschungPublikationen
Eutectic bonding of integrated circuits onto polycarbonate and poly(methyl methacrylate) by means of indium-tin and indium-bismuth

Eutectic bonding of integrated circuits onto polycarbonate and poly(methyl methacrylate) by means of indium-tin and indium-bismuth

Kategorien Zeitschriften/Aufsätze (reviewed)
Jahr 2015
Autoren Meriem Akin, Sonda Moakhar Ep Bouguecha, Juergen Becker, Lutz Rissing
Veröffentlicht in IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI 10.1109/TCPMT.2015.2420531