Eutectic bonding of integrated circuits onto polycarbonate and poly(methyl methacrylate) by means of indium-tin and indium-bismuth
Kategorien |
Zeitschriften/Aufsätze (reviewed) |
Jahr | 2015 |
Autoren | Meriem Akin, Sonda Moakhar Ep Bouguecha, Juergen Becker, Lutz Rissing |
Veröffentlicht in | IEEE Transactions on Components, Packaging and Manufacturing Technology |
DOI | 10.1109/TCPMT.2015.2420531 |