ForschungPublikationen
Hybrid packaging of circuits and devices onto flexible screen printed electrical interconnects

Hybrid packaging of circuits and devices onto flexible screen printed electrical interconnects

Kategorien Konferenz (reviewed)
Jahr 2015
Autoren Meriem Akin, Joe Corea, Simon Scott, Ana Claudia Arias, Marc Wurz, Lutz Rissing
Veröffentlicht in SMTA Pan Pacific Microelectronics Symposium, Kauai, HI, USA
DOI 10.13140/RG.2.1.2064.9763/1