Hybrid packaging of circuits and devices onto flexible screen printed electrical interconnects
| Kategorien |
Konferenz (reviewed) |
| Jahr | 2015 |
| Autoren | Meriem Akin, Joe Corea, Simon Scott, Ana Claudia Arias, Marc Wurz, Lutz Rissing |
| Veröffentlicht in | SMTA Pan Pacific Microelectronics Symposium, Kauai, HI, USA |
| DOI | 10.13140/RG.2.1.2064.9763/1 |
