ForschungPublikationen
Vertical Interconnect Access (VIA) in Technical Porcelain for MEMS

Vertical Interconnect Access (VIA) in Technical Porcelain for MEMS

Kategorien Konferenz (reviewed)
Jahr 2015
Autoren M. Stompe, L. Rissing
Veröffentlicht in Smart System Integration, Copenhagen, proceedings 2015, pp. 461-465