Reduction of Thermomechanical Stress Using Electrically Conductive Adhesives
Kategorien |
Zeitschriften/Aufsätze (reviewed) |
Jahr | 2015 |
Autoren | T. Geipel, L. C. Rendler, M. Stompe, U.h Eitner, L. Rissing |
Veröffentlicht in | Energy Procedia, Volume 77, August 2015, Pages 346-355, ISSN 1876-6102 |
DOI | 10.1016/j.egypro.2015.07.049 |