ForschungPublikationen
Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process

Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process

Kategorien Konferenz (reviewed)
Jahr 2017
Autoren Long Y, Dencker F, Isaak A, Li C, Schneider F, Hermsdor J, Wurz MC, Twiefel J, Wallaschek J
Veröffentlicht in IEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, p. 203-206
Beschreibung