ForschungPublikationen
Visualization of Oxide Removal during Ultrasonic Wire Bonding Process

Visualization of Oxide Removal during Ultrasonic Wire Bonding Process

Kategorien Konferenz (reviewed)
Jahr 2018
Autoren Long Y, Dencker F, Isaak A, Schneider F, Hermsdor J, Wurz MC, Twiefel J
Veröffentlicht in IEEE Electronics Packaging Technology Conference (EPTC), Singapore, p. 1-4