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Electroplating through Fluidic Channels as Production Technology for 3D Interconnect Devices and Sensing Structures

Electroplating through Fluidic Channels as Production Technology for 3D Interconnect Devices and Sensing Structures

Kategorien Konferenz
Jahr 2016
Autoren Rechel M, Bengsch S, Wurz MC
Veröffentlicht in ECS Transactions. 2016 volume 75, issue 7, 25-32
DOI 10.1149/07507.0025ecst
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