ForschungPublikationen
Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process

Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process

Kategorien Konferenz (reviewed)
Jahr 2017
Autoren Long Y, Dencker F, Schneider F, Emde B, Li C, Hermsdorf J, Wurz MC, Twiefel J
Veröffentlicht in Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016
ISBN 978-150904368-2
DOI 10.1109/EPTC.2016.7861512