Revealing of ultrasonic wire bonding mechanisms via metal-glass bonding
| Kategorien |
Zeitschriften/Aufsätze (reviewed) |
| Jahr | 2018 |
| Autoren | Long Y, Dencker F, Isaak A, Li C, Schneider F, Hermsdorf J, Wurz MC, Twiefel J, Wallaschek J |
| Veröffentlicht in | Materials Science and Engineering B: Solid-State Materials for Advanced Technology, Vol 236-237 |
| DOI | 10.1016/j.mseb.2018.11.010 |
